chipunderfill (Newbie) Registration Date: 28-10-2022 Date of Birth: 01-02-1992 (32 years old) Local Time: 29-04-2024 at 02:31 AM Status: Offline

chipunderfill's Forum Info Joined: 28-10-2022 Last Visit: 28-10-2022, 07:22 AM Total Posts: 0 (0 posts per day | 0 percent of total posts) Total Threads: 0 (0 threads per day | 0 percent of total threads) Time Spent Online: 59 Seconds Members Referred: 0 Reputation: 0 [Details] chipunderfill's Contact Details Homepage: https://www.epoxyadhesiveglue.com/chip-underfill-packaging/

Additional Info About chipunderfill Sex: Male Location: Huizhou City, Guangdong，China Bio: Semiconductor technology, especially the packaging of semiconductor devices, has never touched more applications than it does today. As every aspect of everyday life becomes increasingly digital—from automobiles to home security to smartphones and 5G infrastructure—semiconductor packaging innovations are at the heart of responsive, reliable, and powerful electronic capabilities.