bgapackage (Newbie) Registration Date: 06-11-2022 Date of Birth: 01-03-1990 (34 years old) Local Time: 29-04-2024 at 12:34 PM Status: Offline

bgapackage's Forum Info Joined: 06-11-2022 Last Visit: 06-11-2022, 07:09 AM Total Posts: 0 (0 posts per day | 0 percent of total posts) Total Threads: 0 (0 threads per day | 0 percent of total threads) Time Spent Online: 48 Seconds Members Referred: 0 Reputation: 0 [Details] bgapackage's Contact Details Homepage: https://www.epoxyadhesiveglue.com/bga-package-underfill-epoxy/

Additional Info About bgapackage Sex: Undisclosed Location: Huizhou City, Guangdong，China Bio: Electronic products of aerospace and navigation, motor vehicles, automobiles, outdoor LED lighting, solar energy and military enterprises with high reliability requirements, solder ball array devices (BGA/CSP/WLP/POP) and special devices on circuit boards are all facing microelectronics. The trend of miniaturization, and thin PCBs with a thickness of less than 1.0mm or flexible high-density assembly substrates, solder joints between devices and substrates become fragile under mechanical and thermal stress.